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Datacenter Interconnects: Copper vs. Optics, Nvidia's 78-Layer PCB, Co-Packaged Optics (CPO)

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Datacenter Interconnects: Copper vs. Optics, Nvidia's 78-Layer PCB, Co-Packaged Optics (CPO)

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Vik Sekar and Austin Lyons tackle the biggest bottleneck in inference: moving data. They break down the three tiers of datacenter networking — scale up, scale out, scale across — and the core engineering trade-off at each layer: copper vs. optics. Topics i...

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