New episode: Advanced packaging for AI chips, from wire bonds to TSMC CoWOS and Intel EMIB. Packaging is no longer an afterthought. It is the chip, and Intel's EMIB challenges TSMC's CoWOS. * Three CoWOS flavors: silicon, organic RDL, local bridges * EMIB embeds tiny bridges into the substrate, no interposer * EMIB-T and EMIB-M add through-silicon vias and power capacitors * Google is booking 3M TPUs on EMIB via MediaTek by 2028 * Package sizes keep climbing: 5.5x reticle today, 40x ahead This episode is brought to you by SambaNova. Try SambaNova's fast inference today at the SambaNova Dashboard [https://fandf.co/4etZbvP]! Connect with Vik and Austin via a daily free newsletter: https://www.semidoped.com Vik's Paid Substack: https://www.viksnewsletter.com Austin's Paid Substack: https://www.chipstrat.com Chapters: (0:00) "There Is No Chip Without the Packaging" (0:28) Intro and SpaceX IPO Day (5:15) What We're Covering: CoWOS, EMIB, Google (7:40) Simple Packaging: Wire Bonds to Flip Chip (17:07) What Makes Packaging "Advanced" (33:44) CoWOS: Three Flavors Explained (45:30) EMIB: Intel's Embedded Bridge Approach (52:47) EMIB-T and EMIB-M (57:31) CoWOS vs. EMIB Trade-offs (1:02:18) Google's 3M TPU EMIB Order