Advanced Packaging, TSMC CoWoS, Intel EMIB
Semi Doped
Jun 19
Advanced Packaging, TSMC CoWoS, Intel EMIB
Advanced Packaging, TSMC CoWoS, Intel EMIB
Semi Doped
Jun 19
Unprocessed episode, you can be the first!
New episode: Advanced packaging for AI chips, from wire bonds to TSMC CoWOS and Intel EMIB.
Packaging is no longer an afterthought. It is the chip, and Intel's EMIB challenges TSMC's CoWOS.
- Three CoWOS flavors: silicon, organic RDL, local bridges
- EMIB embeds tiny bridges into the substrate, no interposer
- EMIB-T and EMIB-M add through-silicon vias and power capacitors
- Google is booking 3M TPUs on EMIB via MediaTek by 2028
- Package sizes keep climbing: 5.5x reticle today, 40x ahead
This episode is brought to you by SambaNova. Try SambaNova's fast inference today at the SambaNova Dashboard!
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Chapters:
(0:00) "There Is No Chip Without the Packaging"
(0:28) Intro and SpaceX IPO Day
(5:15) What We're Covering: CoWOS, EMIB, Google
(7:40) Simple Packaging: Wire Bonds to Flip Chip
(17:07) What Makes Packaging "Advanced"
(33:44) CoWOS: Three Flavors Explained
(45:30) EMIB: Intel's Embedded Bridge Approach
(52:47) EMIB-T and EMIB-M
(57:31) CoWOS vs. EMIB Trade-offs
(1:02:18) Google's 3M TPU EMIB Order
(0:00) "There Is No Chip Without the Packaging"
(0:28) Intro and SpaceX IPO Day
(5:15) What We're Covering: CoWOS, EMIB, Google
(7:40) Simple Packaging: Wire Bonds to Flip Chip
(17:07) What Makes Packaging "Advanced"
(33:44) CoWOS: Three Flavors Explained
(45:30) EMIB: Intel's Embedded Bridge Approach
(52:47) EMIB-T and EMIB-M
(57:31) CoWOS vs. EMIB Trade-offs
(1:02:18) Google's 3M TPU EMIB Order
